Software Engineer (Thermal Analysis for PCB/Package/Chip)

Location: San Jose / California

Job type

Employment type: Full-Time

Pay: Competitive/hour

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Job description

Req#: R30265

At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.

Responsible for designing, developing, troubleshooting and debugging PCB/package/chip thermal analysis software.
Works on extremely complex problems where analysis of situations or data requires an evaluation of intangible variance factors.

Exercises independent judgment in developing methods, techniques, and evaluation criterion for obtaining results.
Work leadership may be provided by assigning work and resolving problems.


Position Requirements:

  • The candidate should have PhD in ME/EE/CS with 6+ years of industry experience, strong programming skills in C++, and deep familiarity with object-oriented programming methods.

  • Prior knowledge and experience with distributed/multi-threaded programming, numerical analysis techniques, meshing techniques, finite-element based thermal simulation, CFD analysis, and in-depth understanding of electric cooling of PCB/package/chip preferred.

  • Experience on automatic design optimization for thermal targets is a plus.

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About company

Cadence Design Systems, Inc., headquartered in San Jose, California, in the North San Jose Innovation District, is an American multinational electronic design automation software and engineering services company, founded in 1988 by the merger of SDA Sy...
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