Responsible for designing, developing, troubleshooting and debugging PCB/package/chip thermal analysis software.
Works on extremely complex problems where analysis of situations or data requires an evaluation of intangible variance factors.
Exercises independent judgment in developing methods, techniques, and evaluation criterion for obtaining results.
Work leadership may be provided by assigning work and resolving problems.
The candidate should have PhD in ME/EE/CS with 6+ years of industry experience, strong programming skills in C++, and deep familiarity with object-oriented programming methods.
Prior knowledge and experience with distributed/multi-threaded programming, numerical analysis techniques, meshing techniques, finite-element based thermal simulation, CFD analysis, and in-depth understanding of electric cooling of PCB/package/chip preferred.
Experience on automatic design optimization for thermal targets is a plus.
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